• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    For producing a circuit arrangement (40) on a carrier plate (10) with thermal vias (20) which extend through the carrier plate (10) from the upper side (11) to the lower side (12), first the thermal vias (20) are applied the underside (12) by applying a layer of thermally conductive, electrically insulating material (14), which preferably covers the opening of a plurality of vias (20) on the bottom (12) together, and then the thermal vias (20) from the top ( 11) ago with soldering material (16) filled. Preferably, the components (39) on an upper surface (11) of the support plate (10) are applied before the vias (20) are filled in a reflow process.
    公开号:AT516724A4
    申请号:T50934/2014
    申请日:2014-12-22
    公开日:2016-08-15
    发明作者:Emanuel Weber；Gerald Fritz；Martin Biesenberger
    申请人:Zizala Lichtsysteme Gmbh；
    IPC主号:
    专利说明:

    Producing a circuit arrangement with thermal vias
    The invention relates to a method for producing a circuit arrangement on a carrier plate, in which components are applied to an upper side of the printed circuit board, wherein the printed circuit board has thermal vias, which extend through the printed circuit board to an underside opposite the upper side.
    Circuit arrangements of the type considered here are typically carried out on a printed circuit board carrying as a support plate a number of electronic components ("components"), typically on either side of the printed circuit board Agreement with common terminology referred to as "top"; the opposite side is referred to as the "bottom." Electrical connection lines for the electronic components may be located on either side of the circuit board, typically predominately on the underside.The circuit board is conventionally made of a plastic or composite material, such as FR4, for example. an epoxy resin fiberglass material; suitable circuit board materials are known per se and not the subject of the invention.
    Since the components generate heat due to unavoidable power losses during operation, it is also generally necessary to ensure sufficient dissipation of the heat in order to avoid damage to the components up to their destruction. Only in very simple cases, cooling by ambient air and heat conduction in the circuit board without additional measures is sufficient; In most cases, additional measures for passive or active cooling must be taken.
    One known approach to heat dissipation is to provide heat spreader surfaces, e. Surfaces of thermally conductive material on a surface of the circuit board, which are in thermal contact with the component to be cooled. Such a heat spreading surface leads to an effective enlargement of the thermal surface of the component, via which heat can be released. The thermal budget on a printed circuit board is becoming increasingly critical due to the increasing integration as well as the ever-increasing packing density, which results inter alia from limitations of the available space for the printed circuit board and / or its components. The space required for thermally stressed components, which can be used for heat expansion surfaces, is therefore increasingly no longer available in sufficient size. In addition to the greatly increased space requirement on the circuit board top heat spreader surfaces have the further disadvantage that the heat dissipation takes place only to the ambient air and not into a heat sink.
    Another approach to the heat dissipation of thermally stressed components are thermal vias, often called thermal vias or (English) "thermal vias". A thermo-via provides a thermally (and usually also electrically) conductive connection from the top of the board to the bottom to facilitate heat transfer across the board and to bridge the thermal resistance of the board material. However, there are three critical issues to consider when using thermal vias: 1. Common thermal vias are made with metallic material and therefore provide an electrically conductive connection to the PCB bottom. If electrical isolation to the underlying heat sink is required These are therefore additionally implemented. 2. In order to be most efficient thermally, a thermo-via would have to be located directly below a pad terminal of the thermally stressed component. However, conventional thermal vias are not closed, resulting in a hole from the top of the PCB to the bottom. During soldering, therefore, solder is pulled downwards by vias, which are arranged under the component pads, by capillary and gravitational forces; This drastically reduces the soldering quality. In extreme cases, solder is no longer available on the circuit board surface in order to contact the component electrically. 3. Although thermal vias are a highly thermally conductive compound, the surface available for heat removal in unfilled vias is very small. The thermal conductivity is determined only by the thickness of the copper layer in the vias.
    Therefore, the thermal vias in known arrangements are usually outside of the surfaces to be soldered, thus not directly in the component pads, which makes the dissipation of heat difficult; moreover, extended pad areas are required so that thermal vias that lie outside the component pads again lead to increased space requirements.
    One well-known approach is to place thermo-vias in the component pads and plug them in before they are populated with components, such as the printed circuit board manufacturer but expensive.
    To make matters worse, that thermal vias often can not be placed in the most effective place and thus do not afford an optimal heat dissipation. In addition, unfilled vias have a small surface area for heat dissipation and thus provide limited conductivity of the heat path from the component to the heat sink.
    It is therefore an object of the invention to overcome the above drawbacks and to provide a simple and cost effective way of producing efficient thermal vias.
    This object is achieved on the basis of a method of the type mentioned in that according to the invention a) the thermal vias on the bottom are closed by applying a layer of thermally conductive, electrically insulating material, and then b) the thermal vias from the top with solder material be filled.
    This inventive solution includes as a basic idea that a layer of thermally conductive, electrically insulating material is applied in a first process step on the still bare circuit board backside, for example by a printing method known per se. As such material is in particular so-called thermal interface material ( TIM), such as Thermal paste, into consideration. By using this layer, the vias are closed at the bottom and prevent uncontrolled flow away of the solder during a subsequent soldering.
    As a result of the invention, the thermal path from the component on the printed circuit board to the heat sink can be realized continuously with materials having good thermal conductivity (sequence solder copper - solder filled via TIM). The inventive layer of thermally conductive, electrically insulating material allows in particular 1. better heat connection from the back of the circuit board to the heat sink, 2. electrical insulation of printed circuit board back to the heat sink, 3. a mechanical barrier for the solder, passing through the solder by thermal vias to the PCB underside prevented.
    This layer results in little or no additional cost and yet optimum thermal dissipation of the heat from components on the board top to the heat sink can be ensured.
    The inventive method is particularly suitable for use in the manufacture of a printed circuit board of a vehicle headlamp, wherein the circuit board comprises a carrier plate having at least one thermal via, which lies in the region of a connection pads of a light-generating component. This via is thus filled by the method according to the invention.
    In a particularly favorable development of the invention, on the one hand, the cooling capacity can additionally be increased and, on the other hand, a simple design of the TIM layer can be utilized if the layer applied in step a) covers the opening of several plated-through holes on the underside together.
    In a particularly advantageous variant, the thermal plated-through holes in step a) can at least predominantly remain free in their areas between the lower and the upper side and can only be filled in step b).
    In addition, step b) can be carried out by an elevated temperature soldering process, preferably a reflow process.
    The assembly of the components can be advantageously carried out between steps a) and b), for example, by the fact that after step a) first solder paste is applied to the thermal vias on the top and then the components are equipped.
    The invention together with further advantages and refinements will be explained in more detail below with reference to a non-limiting exemplary embodiment, which is illustrated in the attached drawings. The drawings show:
    Fig. 1 is a circuit board with thermal vias, which have been produced in a conventional manner;
    FIGS. 2a-c show the production of a printed circuit board with a solder using the method according to the invention; and
    Fig. 3 shows the completed circuit arrangement.
    1 shows a printed circuit board 30 in which two solder-filled thermal vias 34, 35 are provided in the region of a pad 38 of a component 39 which is arranged on the upper side 31 of the printed circuit board 30 and that via solder 33 filled thermal vias 34, 35 to be cooled via the bottom 32. Using the example of this circuit board 30, the problems that may occur with thermal vias of this type are illustrated in FIG. Both vias are open to the bottom 32. This leads, for example, in the case of via 34 to the fact that it was incompletely filled with solder 33 and / or solder has flowed off to underside 32; discharged solder may e.g. be drained or expired to the side where it may possibly form interfering drops 36. Even if a via 35 remains completely filled with solder 33, it is to be expected that during the soldering process a more or less large part of the solder will run off the via, which may lead to solder 31 in the area of the pad 38 on the top side is missing, so that voids 37 form in the solder, which reduce the thermal conductivity and thus hinder the heat dissipation from the component 39 to the bottom 32 out.
    According to the invention, before the circuit board is soldered, a layer of TIM is printed on the underside of the circuit board. The TIM has a high thermal conductivity and sufficient electrical insulation resistance. This allows thermal vias to be inserted directly into the pads of thermally stressed components - e.g. LEDs from Schweinwerfern - to place without this leading to the disadvantages described above. This will be explained below with the embodiment of Figs. 2a to 2c.
    FIG. 2 a shows a printed circuit board 10, which corresponds structurally to the printed circuit board 30 of FIG. 1. The circuit board is made of FR-4 material, for example; in area 13 of a pad, which is provided for a component to be applied on the upper side 11 of the printed circuit board in a later step, there are two thermal vias 20 with a diameter of typically 350 gm; but also larger diameters are possible thanks to the invention, wherein larger vias are also easier to fill and provide a higher overall thermal conductivity. The two vias 20 are in the embodiment shown representative of any number of one, two, three or more thermal vias, the number depending on the application and desired heat transfer (cooling capacity) can be selected to the bottom 12. In particular, a thermal via or two or more may be provided per component; For example, in an LED circuit board of a headlamp, one LED of the type OSLON Compact is typically assigned six thermal vias. The thermal vias 20 are made in a known manner from one - usually cylindrical - bore whose inner surface with an electrically conductive material -. Copper - lined and merges at the two openings on the top and bottom in each of a flat region 21, 22. The area 21 on the top 11 and that 22 on the bottom 12 may coincide in terms of surface shape or (not shown) be different in size.
    According to the invention, as shown in FIG. 2a, in a first step, a layer 14 of a TIM, for example a thermal paste heat-resistant to the temperatures of the subsequent soldering process, is printed on the underside 12 so that the vias 20 are closed at their lower openings. The layer 14 preferably covers the entire region 22 of the vias 20 and, moreover, can still project beyond the edge of the region 22, thereby achieving electrical insulation of the vias on the underside. The TIM of the layer 14 is printed over the vias according to the invention and does not penetrate the vias (due to its viscosity, for example); the interface of the TIM layer to the bottom of a vias is only slightly sickle-shaped (viewed in longitudinal section). The size of a single area of the printed layer 14 is typically in the range of one square centimeter, these areas are not usually over the entire surface, but structured.
    Then - Fig. 2b - printed on a conventional type solder paste 15 on the circuit board top side and the component 39 including its the circuit board 10 facing component pads 38 is fitted. The pad 38 serves both the electrical and the thermal contact of the component 39; In other applications, a pad can also be used only for a thermal connection. The solder paste is a SnAgCu solder of a known type with a silver content of e.g. 3%; a higher silver content can improve the thermal conductivity, but leads to the risk of forming an undesirable, brittle Ag3Sn phase.
    The assembly is then placed in a reflow oven, where the actual soldering is done by reflow soldering: the solder over the pads with the thermal vias 20 liquefies and flows into the cavities of the same. Fig. 2c shows the result of this process. The solder 16 fills the vias 20 completely. The amount of solder 16 needed for via filling may be provided by solder paste extensions on the circuit board top 11 (not shown). By virtue of the TIM layer 14 applied according to the invention on the underside, however, the solder 16 is prevented from flowing away onto the underside of the printed circuit board 12, as is the formation of undesirable gaps or bubbles in the solder 16 which otherwise (see Fig. 1) occur as a result of loss of solder material could.
    After the soldering operation, if desired, a heat sink 24 can be applied over the underside 12 of the printed circuit board 10 to the TIM layer 14, which by its shaping, the heat transfer, e.g. to the cooling air or (not shown) a cooling medium additionally improved. The heat sink 24 can be applied directly to the TIM layer 14 or by means of an adhesive layer (not shown), wherein for mechanical fixing an attachment by means of a screw 23 or the like. May be provided.
    Fig. 3 shows the obtained circuit arrangement 40 of the embodiment. Of course, the embodiment shown is not intended to be limiting of the invention, but merely serves to illustrate the invention, which extends to a variety of possible embodiments.
    As a result of the method according to the invention, there is a highly thermally conductive connection from the component pad BP via the thermal vias 20 directly to the heat sink 24. About the filled with solder vias is also, compared to a design with unfilled vias, for heat dissipation to Available effective cross-sectional area in the circuit board 10 greatly increased. The filled vias have a thermal resistance Rth, which is typically about 2/3 of the thermal resistance Rth of the corresponding unfilled vias, and can be further reduced by increasing the cross-sectional area of the vias. The TIM used in the embodiment preferably has a withstand voltage of 20 to 30 kV / mm. Such a value of the dielectric strength is favorable in order to achieve sufficient mutual electrical insulation of components on the printed circuit board without further insulation to the heat sink 24, for example of series-connected LEDs in an LED printed circuit board of a headlight.
    The high thermal conductivity of the TIM allows it to be applied over its entire surface in the form of layer 14. Therefore, only one printing step is required. The fact that the solder 16 thermally contacts the TIM layer 14 in the thermal vias 20 increases the effective cross section of the heat-conducting path.
    权利要求:
    Claims (6)
    [1]
    claims
    1. A method for producing a circuit arrangement (40) on a carrier plate (10), in which components (39) on an upper side (11) of the carrier plate (10) are applied, wherein the carrier plate (10) has thermal vias (20), extending through the support plate (10) to one of the top (11) opposite bottom (12), characterized in that a) the thermal vias (20) on the bottom (12) by applying a layer (14) thermally conductive , electrically insulating material, and then b) the thermal vias (20) from the top (11) forth with solder material (15,16) are filled.
    [2]
    2. The method according to claim 1, characterized in that the applied in step a) layer (14) on the underside (12) covers the opening of a plurality of plated-through holes (20) together.
    [3]
    3. The method according to claim 1 or 2, characterized in that the thermal vias (20) in step a) remain at least predominantly free in their areas between the bottom and the top and only in step b) are filled.
    [4]
    4. The method according to any one of the preceding claims, characterized in that step b) by a soldering at elevated temperature, preferably a reflow process takes place.
    [5]
    5. The method according to any one of the preceding claims, characterized in that after step a) and before step b) solder paste (15) on the thermal vias (20) on the top (11) is applied and then the components (39) equipped become.
    [6]
    6. Use of the method according to any one of the preceding claims in the manufacture of a printed circuit board of a vehicle headlamp, wherein the circuit board comprises a support plate (10) having at least one thermal through-hole (20) which lies in the region of a connection pads of a light-generating component (39).
    类似技术:
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    同族专利:
    公开号 | 公开日
    AT516724B1|2016-08-15|
    CN105722308B|2019-05-28|
    CN105722308A|2016-06-29|
    EP3038436A1|2016-06-29|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE19842590A1|1998-09-17|2000-04-13|Daimler Chrysler Ag|Process for the production of circuit arrangements|
    DE19909505A1|1999-03-04|2000-09-21|Daimler Chrysler Ag|Process for the production of circuit arrangements|
    WO2002056652A2|2001-01-13|2002-07-18|Conti Temic Microelectronic Gmbh|Method for the production of an electronic component|
    EP2129197A1|2008-05-30|2009-12-02|Delphi Technologies, Inc.|Method of manufacturing a printed circuit board.|
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    EP0869704A1|1997-03-31|1998-10-07|Ford Motor Company|Method of mounting components on a printed circuit board|DE112017002446T5|2016-07-08|2019-02-28|Hitachi Automotive Systems, Ltd.|Power conversion device|
    EP3562279A1|2018-04-25|2019-10-30|Siemens Aktiengesellschaft|Production of an electrical connection of components with a contacting plate|
    法律状态:
    2016-11-15| HC| Change of the firm name or firm address|Owner name: ZKW GROUP GMBH, AT Effective date: 20161014 |
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50934/2014A|AT516724B1|2014-12-22|2014-12-22|MAKING A CIRCUIT ARRANGEMENT WITH THERMAL CONTACT|ATA50934/2014A| AT516724B1|2014-12-22|2014-12-22|MAKING A CIRCUIT ARRANGEMENT WITH THERMAL CONTACT|
    EP15197167.8A| EP3038436B1|2014-12-22|2015-12-01|Production of a circuit assembly with thermal vias|
    CN201510966149.XA| CN105722308B|2014-12-22|2015-12-22|Manufacture the line unit with the plated-through hole of heat|
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